Iphone 11 motherboard

iPhone 11 Logic Board - Detailed Specifications

The logic board is the main printed circuit board (PCB) that houses the core components of the device.

1. Core Component: A13 Bionic Chip

• Model: APL1W85 (Same chip as iPhone 11 Pro/Pro Max).

• Process Node: 7 nanometers (7nm).

• CPU: Hexa-core (6-core) CPU:

  • 2 high-performance "Lightning" cores.

  • 4 high-efficiency "Thunder" cores.

• GPU: 4-core Apple-designed graphics processor.

• Neural Engine: 8-core Neural Engine for machine learning (1 trillion operations per second).

2. Memory (RAM)

• Capacity: 4 GB of LPDDR4X RAM.

• Integration: Package-on-Package (PoP) design, meaning the RAM is physically stacked on top of the A13 Bionic chip for ultra-fast data transfer.

3. Storage (NAND Flash)

• Options: 64GB, 128GB, or 256GB of NVMe-based flash storage.

• Type: Soldered directly onto the logic board; not user-upgradeable.

4. Modem (Cellular Connectivity)

• Model: Intel XMM 7660 LTE modem.

• Technology: 4G LTE Advanced. The iPhone 11 does not support 5G networks.

• Features: Gigabit-class LTE, 4x4 MIMO.

5. Wireless Connectivity

• Wi-Fi: Wi-Fi 6 (802.11ax) for faster speeds and better performance in crowded networks.

• Bluetooth: Bluetooth 5.0 for improved range and data transfer.

• NFC: With reader mode for Apple Pay.

• UWB (Ultra-Wideband): This model does NOT have the U1 chip. The U1 chip was included in the Pro models that year but omitted from the standard iPhone 11.

6. Physical Design & Repair

• Layout: The iPhone 11 uses a single-layer logic board design. This is a key difference from the more complex and compact double-layer stacked board found in the 11 Pro and Pro Max models. This makes it generally easier and less expensive to repair.

• Common Points of Failure:

  • Baseband Issues: "No Service" problems are a common fault.

  • Audio IC Failure: Can cause issues with the microphones, speaker, or voice dictation.

  • Charging Issues: Often related to the charging IC (e.g., Tristar chip).

Summary Table