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Iphone 11PM Motherboard

SKU: JHTMI11O001
The central motherboard features the A13 Bionic chip (7nm, 6-core CPU/4-core GPU), 4GB RAM, and 64/256/512GB storage. Includes an Intel LTE modem (4G, no 5G), Wi-Fi 6Bluetooth 5.0, and a U1 Ultra-Wideband chip. Its double-layer stacked design makes repairs complex. Common issues include baseband and audio IC failures. This is the clean and unlocked logic board which can be used for the phone replacement.
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  • Description

iPhone 11 Pro Max Logic Board - Key Details

The logic board (or motherboard) is the central nervous system of the phone, housing all critical components.

1. Core Component: A13 Bionic Chip

  • Model: APL1W85 (Apple's internal designation).

  • Process Technology: 7 nanometers (7nm).

  • Architecture: 64-bit ARMv8.3-A.

  • CPU: Hexa-core (6-core) CPU:

    • 2 high-performance cores named Lightning.

    • 4 high-efficiency cores named Thunder.

  • GPU: 4-core Apple-designed graphics processor.

  • Neural Engine: 8-core Neural Engine for machine learning tasks, capable of performing 1 trillion operations per second.

2. Storage (NAND Flash Memory)

  • Options: Soldered directly onto the board. Available in 64GB, 256GB, and 512GB capacities.

  • Type: NVMe-based flash storage.

3. Memory (RAM)

  • Capacity: 4 GB of LPDDR4X RAM.

  • Integration: The RAM is stacked on top of the A13 Bionic chip in a Package-on-Package (PoP) design for faster communication.

4. Modem (Cellular Connectivity)

  • Model: Intel XMM 7660 (in most models).

  • Technology: 4G LTE Advanced Pro. This model does not support 5G.

  • Features: Gigabit-class LTE, 4x4 MIMO, LAA.

5. Other Key Chips & Components

  • Wi-Fi/Bluetooth: Broadcom chip supporting Wi-Fi 6 (802.11ax) and Bluetooth 5.0.

  • UWB (Ultra-Wideband): Not present. This technology was introduced starting with the iPhone 11* (which has U1 chip), but the 11 Pro Max does include the U1 chip for spatial awareness.

  • Power Management: Apple-specific PMIC (Power Management Integrated Circuit).

  • Audio Chip: Custom Apple audio processor.

6. Physical Characteristics & Repair

  • Design: Double-layer stacked board. This complex design makes repairs like microsoldering extremely difficult and is a primary reason Apple recommends board swaps instead of component-level repair.

  • IC (Integrated Circuit) Layout: The board contains hundreds of small chips responsible for functions like:

    • Charging (Tristar, Tigris)

    • Touch controller

    • Display backlight control

    • Camera control

  • Common Issues: Common logic board failures on this model can include:

    • Baseband issues (no service)

    • Audio IC failures (no microphone/speaker)

    • Charging faults


Summary Table

Component Specification Notes
SoC Apple A13 Bionic 7nm, 6-core CPU, 4-core GPU
RAM 4 GB LPDDR4X PoP (stacked on A13 chip)
Storage 64/256/512 GB NVMe Soldered, not upgradable
Modem Intel XMM 7660 4G LTE, no 5G
Wi-Fi Wi-Fi 6 (802.11ax)
Bluetooth Bluetooth 5.0
UWB Yes (U1 Chip) For spatial awareness
Board Type Double-layer stacked Highly complex for repair



Package for delivery
1. Each motherboard in one individual box, full protection and seald;
2.Product IMEI and serial number on box;
3. Delivery time: 7 ~12 days by air.
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