The logic board (or motherboard) is the central nervous system of the phone, housing all critical components.
Model: APL1W85 (Apple's internal designation).
Process Technology: 7 nanometers (7nm).
Architecture: 64-bit ARMv8.3-A.
CPU: Hexa-core (6-core) CPU:
2 high-performance cores named Lightning.
4 high-efficiency cores named Thunder.
GPU: 4-core Apple-designed graphics processor.
Neural Engine: 8-core Neural Engine for machine learning tasks, capable of performing 1 trillion operations per second.
Options: Soldered directly onto the board. Available in 64GB, 256GB, and 512GB capacities.
Type: NVMe-based flash storage.
Capacity: 4 GB of LPDDR4X RAM.
Integration: The RAM is stacked on top of the A13 Bionic chip in a Package-on-Package (PoP) design for faster communication.
Model: Intel XMM 7660 (in most models).
Technology: 4G LTE Advanced Pro. This model does not support 5G.
Features: Gigabit-class LTE, 4x4 MIMO, LAA.
Wi-Fi/Bluetooth: Broadcom chip supporting Wi-Fi 6 (802.11ax) and Bluetooth 5.0.
UWB (Ultra-Wideband): Not present. This technology was introduced starting with the iPhone 11* (which has U1 chip), but the 11 Pro Max does include the U1 chip for spatial awareness.
Power Management: Apple-specific PMIC (Power Management Integrated Circuit).
Audio Chip: Custom Apple audio processor.
Design: Double-layer stacked board. This complex design makes repairs like microsoldering extremely difficult and is a primary reason Apple recommends board swaps instead of component-level repair.
IC (Integrated Circuit) Layout: The board contains hundreds of small chips responsible for functions like:
Charging (Tristar, Tigris)
Touch controller
Display backlight control
Camera control
Common Issues: Common logic board failures on this model can include:
Baseband issues (no service)
Audio IC failures (no microphone/speaker)
Charging faults
| Component | Specification | Notes |
|---|---|---|
| SoC | Apple A13 Bionic | 7nm, 6-core CPU, 4-core GPU |
| RAM | 4 GB LPDDR4X | PoP (stacked on A13 chip) |
| Storage | 64/256/512 GB NVMe | Soldered, not upgradable |
| Modem | Intel XMM 7660 | 4G LTE, no 5G |
| Wi-Fi | Wi-Fi 6 (802.11ax) | |
| Bluetooth | Bluetooth 5.0 | |
| UWB | Yes (U1 Chip) | For spatial awareness |
| Board Type | Double-layer stacked | Highly complex for repair |

