Iphone XR motherboard

Core Components

System on a Chip (SoC)

• Model: Apple A12 Bionic

• Process: 7-nanometer (7nm)

• CPU: 6-core (2x high-performance "Vortex" + 4x high-efficiency "Tempest")

• GPU: 4-core Apple-designed GPU

• Neural Engine: 8-core (5 TOPS performance)
  
  

  Memory

  • RAM: 3GB LPDDR4X

  • Storage: 64GB / 128GB / 256GB NVMe NAND flash (soldered)
    
    

    Modem

    • Model: Intel XMM 7560

    • Connectivity:

      • 4G LTE Advanced (Gigabit-class)

      • No 5G support

      • Dual SIM (Nano-SIM + eSIM)
        
        

        Connectivity & Wireless

        • Wi-Fi: IEEE 802.11ac (Wi-Fi 5)

        • Bluetooth 5.0

        • NFC with reader mode (Apple Pay)

        • GPS/GNSS (Global Navigation Satellite System)
          
          

          Power Management

          • Apple-specific PMIC (Power Management Integrated Circuit)

          • Wireless Charging: Qi standard (7.5W)

          • Wired Charging: USB-PD (18W fast charging supported)
            
            

            Physical Design

            • Single-Layer PCB: Simplified design compared to iPhone X/XS stacked boards, improving repairability.

            • Shielded Components: EMI shielding for signal integrity.

            • Component Serialization: Face ID system paired to the board.
              
              

              Key Integrated Circuits (ICs)

              • Tristar IC (charger IC)

              • Tigris IC (USB controller)

              • Audio IC (audio processing)

              • Baseband Processor (cellular communication)
                
                

                Common Issues

                • Baseband Failure: "No Service" errors

                • Audio IC Defects: Microphone/speaker malfunctions ("Grayed Out Speaker")

                • Charging Problems: Tristar/Tigris IC failure

                • Face ID Issues: Paired to logic board; difficult to repair if damaged
                  
                  

                  Repair Notes

                  • Easier Repairs: Single-layer design simplifies microsoldering compared to stacked boards.

                  • Software Calibration: Display replacements may require calibration for True Tone.

                  • Face ID Compatibility: Replacement parts may not work due to serialization.
                    
                    Package for delivery
                    1. Each motherboard in one individual box, full protection and seald;
                    2.Product IMEI and serial number on box;
                    3. Delivery time: 7 ~12 days by air.