IPhone X motherboard

Core Components

System on a Chip (SoC)

• Model: Apple A11 Bionic

• Process: 10-nanometer (10nm)

• CPU: 6-core (2x high-performance "Monsoon" + 4x high-efficiency "Mistral")

• GPU: 3-core Apple-designed GPU

• Neural Engine: Dual-core (600 billion operations/sec)
  
  

  Memory

  • RAM: 3GB LPDDR4X

  • Storage: 64GB / 256GB NVMe NAND flash (soldered)

  Modem

  • Model: Intel XMM 7480

  • Connectivity:

    • 4G LTE (Gigabit-class)

    • No 5G support

    • Dual SIM (Nano-SIM + eSIM)
      
      

      Connectivity & Wireless

      • Wi-Fi: IEEE 802.11ac (Wi-Fi 5)

      • Bluetooth 5.0

      • NFC with reader mode (Apple Pay)

      • GPS/GNSS (Global Navigation Satellite System)
        
        

        Power Management

        • Apple-specific PMIC (Power Management Integrated Circuit)

        • Wireless Charging: Qi standard (7.5W)

        • Wired Charging: USB-PD (18W fast charging supported)
          
          

          Physical Design

          • Stacked PCB: Dual-layer design for compactness

          • Shielded Components: EMI shielding for signal integrity

          • Component Serialization: Face ID system paired to the board
            
            

            Key Integrated Circuits (ICs)

            • Tristar IC (charger IC)

            • Tigris IC (USB controller)

            • Audio IC (audio processing)

            • Baseband Processor (cellular communication)
              
              

              Common Issues

              • Baseband Failure: "No Service" errors

              • Audio IC Defects: Microphone/speaker malfunctions

              • Face ID Issues: Paired to logic board; difficult to repair

              • Charging Problems: Tristar/Tigris IC failure
                
                

                Repair Notes

                • Microsoldering Required: Component-level repairs need expertise

                • Face ID Compatibility: Replacement parts may not work due to serialization

                • Water Damage Susceptibility: Dense layout increases corrosion risk
                  
                  Package for delivery
                  1. Each motherboard in one individual box, full protection and seald;
                  2.Product IMEI and serial number on box;
                  3. Delivery time: 7 ~12 days by air.